Ben
3rd May 2005, 07:02 PM
http://www.electronicsweekly.co.uk/articles/article.asp?liArticleID=39531&liArticleTypeID=1&liCategoryID=1&liChannelID=2&liFlavourID=1&sSearch=&nPage=1
Freescale Semiconductor is working on producing a 3G mobile phone module the size of a postage stamp.
"We will have a 3G mobile phone module measuring 18x30mm late next year," Sumit Sadana, senior v-p for strategy at Freescale told Future Horizons' IEF 2005 meeting taking place in Malta this week.
Sadana said the first version would come in a stacked die package containing four chips. "We still need to get the yields up and we still need a significant amount of system-on-chip integration," said Sadana.
The company aims to reduce power by 40 to 50 per cent and reduce cost by 30 per cent at each generation of the product.
Sounds hopeful - rapidly decreasing power consumption, size and cost is just what 3G needs. As unit shipments increase, economies of scale will also kick in. It's going to be very exciting when a critical mass of mobile subscribers are video-enabled.
Freescale Semiconductor is working on producing a 3G mobile phone module the size of a postage stamp.
"We will have a 3G mobile phone module measuring 18x30mm late next year," Sumit Sadana, senior v-p for strategy at Freescale told Future Horizons' IEF 2005 meeting taking place in Malta this week.
Sadana said the first version would come in a stacked die package containing four chips. "We still need to get the yields up and we still need a significant amount of system-on-chip integration," said Sadana.
The company aims to reduce power by 40 to 50 per cent and reduce cost by 30 per cent at each generation of the product.
Sounds hopeful - rapidly decreasing power consumption, size and cost is just what 3G needs. As unit shipments increase, economies of scale will also kick in. It's going to be very exciting when a critical mass of mobile subscribers are video-enabled.